GST417W is one of the Wafer Level Packing (WLP) VOx uncooled focal plane array detectors developed by Global Sensor Technology (GST). Its resolution is 400x300 with pixel size at 17μm.
Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector.
Thanks to the WLP technology, the GST417W uncooled microbolometer produces clear infrared thermal image up to 120,000 pixels without compromise in size, which enables wide application in almost all popular applications such as thermography, security monitoring, firefighting, autonomous driving, personal vision etc.
As a leading infrared detector and thermal imaging module supplier, we have provided our customers with various mature and stable infrared thermal imaging solutions. It’s easier for WLP uncooled VOx microbolometer sensors developed by GST to be integrated into more terminal products and greatly reduces the cost for customers.
Security & Monitoring
Elevated Skin Temperature
|Digital Output||Built-in 14 bits ADC|
|Thermal Response Time||<12ms|
|Operation Temperature||-40°C ~ +85°C|
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