• Uncooled LWIR Infrared Sensor 400×300/17μm | GSTiR
  • Uncooled LWIR Infrared Sensor 400×300/17μm | GSTiR


WLP 400×300/17μm VOx Uncooled Infrared Detector

Main Features:

  • Meet Growing Demands
    • Volume production at lower cost
    Easier Integration
    • Ultra-small size
    • Ultra-light weight
    • TECless technology
    Optimal & Sharp Imaging
    • High sensitivity, typical NETD<40mK
    • Excellent image quality with frame rate at 50Hz


GST417W is one of the Wafer Level Packing (WLP) VOx uncooled focal plane array thermal sensor detectors developed by Global Sensor Technology (GST). Its resolution is 400×300 with pixel size at 17μm.

Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector.

Thanks to the WLP technology, the GST417W uncooled microbolometer produces clear infrared thermal image up to 120,000 pixels without compromise in size, which enables wide application in almost all popular applications such as thermography, security monitoring, firefighting, autonomous driving, personal vision etc.

As a leading infrared detector and thermal imaging module supplier, we have provided our customers with various mature and stable infrared thermal imaging solutions. It’s easier for WLP uncooled VOx microbolometer sensors developed by GST to be integrated into more terminal products and greatly reduces the cost for customers.



Model GST417W
Sensitive Material Vanadium Oxide
Resolution 400×300
Pixel Size 17μm
Spectral Range 8~14μm
Typical NETD <40mK
Digital Output Built-in 14 bits ADC
Thermal Time Constant <12ms
Max Frame Rate 50Hz
Power Consumption ≤180mW
Size (mm) 18×16×2.75 (Without Interface)
Weight <2g
Operating Temperature -40°C ~ +85°C

For more information, please click the button below to download a PDF of the product.

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