Wafer-Level-Package 256×192/12μm VOx Microbolometer Uncooled Thermal Detector Sensor

Description:

GST212W is one of the Wafer Level Packing (WLP) uncooled infrared detectors developed by Global Sensor Technology (GST). Wafer level packaging (WLP) is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared detector.

This long wave vanadium oxide (VOx) microbolometer focal plane array IR detector covers wavelength from 8 to 14μm. And its resolution is 256×192 with pixel size at 12μm.

The GST212W infrared FPA detector is specially developed for small size, light weight & low price (SWaP), which has achieved high volume production with annual output up to 1,000,000 pieces. Due to its lightweight and low price, GST212W uncooled thermal detector can be widely used in many industries such as Thermography, Security Monitoring, Outdoors, AIoT, Intelligent Hardware, Smart Building, Smart Home, UAV Payloads, Epidemic Prevention, ADAS and many other new emerging markets like consumer electronics. 

Until now, we have provided our customers with various mature and stable infrared thermal imaging solutions. It’s very easy for WLP ir detector sensors developed by GST to be integrated into infrared thermal camera products and greatly reduces the cost for customers.